HomeMy WebLinkAbout20231694 Ver 1_More Info Received_20240108I D tscrl be the exiF ln,g land use -or condition of the It -a at thL, time pf this application I;resldentlal,
undeveloped, etc y �; D ?�
6. Describe ptnposed v"k {include discusslon as to how hard'enIns of shoreline has beer, avoided, Or
why it Is neC255ero,
7. Will work be conduit-ed fr-am land? From wax-er? ❑
R. Total amount of Impa ets below *he normal pool lake level / Normal Water LEI
Permanent Imp is (irlcluding all excarallon, backfili, rip rap, retaining wallas etc) In Square feet;
Temporary Impam In square feet; Ai LA,
9. Tota I amount of impacts abcve the norma I Pool lake level/ No mall Walter Level and S&fW Lend.
we rd
Pe-rmanent I mpaets; including hark fl II, excavation, rip rap+ retalnlr g via Iis, mr-1 in sq ua re feet;
Terr`porery impacts (tempuq ry Bearing, construction corridor In sq uare feet:
M Plea se d,escrlbe t he vegetation above t-he rwrmall pool lake level/ Normal Water Legal and so feet
Ia ndWi3Fd to be Irn patted tnuMber Of trMr for instance)!
11. Signature
By s4rLini� below, Ir as the projert proponent, certFfyr tD the fullowlng:
The PrClect prOpnnent hereby Gerd ies that :1I1 inforinatlon connlned hereln it true, imxu rate,
and COMPkIte to the best of my knowledge and Ihelief
The project proponent hereW requests than the certltong authori;tyr Miew arrd take action on
tht5 CWA 401 Cartificatlon request. vwilthirr the applioa Ve reasonable. period of time
f
pr_ _ ature' [J. ALIJ` k D2H .0-;Q2�ftil Date
nt s*llrrtr w is v91W 0* Jan uuVwri-za an letter f turn tine owner is provddedL
12, Pleaw appromirnatefw sketch thL- following infflrrnatlon on this plan and provide dimierrsimff r
emb UM,
a. All proposed vegetation clearing
b. Location of rip rap or fill to he placed above the Shill Pond/ NQUMI: Wafer tevel elevation
c. Locatlon of rip rap or fill to he placed beJow the Fuld pond/ I+Porrml Water UbVel.levation
d, Lacatlon of any proposed structu res such as buildings, retake ft walls, do , etc-
e, Location. of any excavaUan & d nWgigS befnw the Fall PWd/ Nofrml Wafer E.ewel eletiaUm
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